Technoprobe | PUBLICATIONS

mobile

other

Publications

28/06/2017

HBM MICRO PILLAR GRID ARRAY PROBING CHALLENGES

Awarded best presentation at SWTW-2017 - Presented by ‘Samsung Korea’ and ‘Technoprobe’......

SEE PUBLICATION

27/06/2017

PULSED CCC AND MAC: A NUMERICAL MODEL FOR VERTICAL PROBE DESIGN

Presented by Technoprobe at SWTW-2017...

SEE PUBLICATION

28/06/2016

AMD HIGH PIN COUNT PROBING CHALLENGES ON LEADING EDGE GPU: TECHNOPROBE TPEG MEMS VS. COBRA

Awarded best presentation at SWTW-2016 - Presented by ’AMD’, ‘Advantest’ and ‘Technoprobe’...

SEE PUBLICATION

28/06/2016

A NEW APPROACH TO LOW PIN COUNT PRODUCTS TEST FOUND VERTICAL PROBES FOR TO BE SUPERIOR TO CANTILEVER

Presented by ’TI’ and ‘Technoprobe’...

SEE PUBLICATION

28/06/2016

GENERAL OVERVIEW ON PAD DAMAGE: PROBE KEY PARAMETERS AND OTHER CAUSES

Presented by ’Technoprobe’...

SEE PUBLICATION

28/06/2015

CHALLENGES PROBING NEXT GENERATION FULL ARRAY PRODUCTS WITH 60 UM PITCH AND BELOW

Presented by ’Technoprobe’, ‘ITS’ and ‘IMEC’...

SEE PUBLICATION

28/06/2014

ADDRESSING 80 UM PITCH CU PILLAR BUMP WAFER PROBING: TECHNOPROBE TPEG™ MEMS SOLUTION

Presented by ‘STMicroelectronics’ and ‘Technoprobe’...

SEE PUBLICATION

28/06/2014

HIGH PULSED CURRENT WAFER PROBING IN HIGH TEMPERATURE CONDITIONS: COMPREHENSIVE FRAMEWORK FOR VERTICAL AND CANTILEVER PROBE DESIGN

Presented by ‘Technoprobe’...

SEE PUBLICATION

28/06/2013

PROBING OF BUMP WAFER: TPEG™ MEMS T3 VERSUS COBRA LIKE TECHNOLOGY

Presented by ‘STMicroelectronics’ and ‘Technoprobe’...

SEE PUBLICATION

28/06/2012

TPEG™: A NEW VERTICAL MEMS SOLUTION FOR HIGH CURRENT, LOW PITCH APPLICATIONS

Presented by ’Technoprobe’...

SEE PUBLICATION

23/06/2012

Improved Cantilever Probing minimizing scrub Marks – (“No Scrub Technology”)

Presented by ‘Freescale’ semiconductor and ‘Technoprobe’...

SEE PUBLICATION

23/06/2012

Wafer Probing challenges for automotive market

Presented by ‘ON Semiconductor’ and ‘Technoprobe’...

SEE PUBLICATION