Technoprobe | PUBLICATIONS

05/06/2018

Awarded best overall presentation – SWTW 2018

Micro burn-in techniques at wafer-level test to implement cost effective solutions Presented by Melexis and Technoprobe...

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05/06/2018

Awarded best data presentation – SWTW 2018

Probing solutions and inherent customization to enable advanced copper-based 3D integration schemes Presented by Technoprobe...

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04/06/2018

TPEG™ MEMS RF+ Technology for Vertical Probe Heads

Presented by Technoprobe at SWTW 2018...

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04/06/2018

TPEG™ Mantis: a new solution for multiple advanced applications

Presented by Technoprobe at SWTW 2018...

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28/06/2017

HBM MICRO PILLAR GRID ARRAY PROBING CHALLENGES

Awarded best presentation at SWTW-2017 - Presented by ‘Samsung Korea’ and ‘Technoprobe’......

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27/06/2017

PULSED CCC AND MAC: A NUMERICAL MODEL FOR VERTICAL PROBE DESIGN

Presented by Technoprobe at SWTW-2017...

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28/06/2016

AMD HIGH PIN COUNT PROBING CHALLENGES ON LEADING EDGE GPU: TECHNOPROBE TPEG MEMS VS. COBRA

Awarded best presentation at SWTW-2016 - Presented by ’AMD’, ‘Advantest’ and ‘Technoprobe’...

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28/06/2016

A NEW APPROACH TO LOW PIN COUNT PRODUCTS TEST FOUND VERTICAL PROBES FOR TO BE SUPERIOR TO CANTILEVER

Presented by ’TI’ and ‘Technoprobe’...

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28/06/2016

GENERAL OVERVIEW ON PAD DAMAGE: PROBE KEY PARAMETERS AND OTHER CAUSES

Presented by ’Technoprobe’...

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28/06/2015

CHALLENGES PROBING NEXT GENERATION FULL ARRAY PRODUCTS WITH 60 UM PITCH AND BELOW

Presented by ’Technoprobe’, ‘ITS’ and ‘IMEC’...

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28/06/2014

ADDRESSING 80 UM PITCH CU PILLAR BUMP WAFER PROBING: TECHNOPROBE TPEG™ MEMS SOLUTION

Presented by ‘STMicroelectronics’ and ‘Technoprobe’...

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28/06/2014

HIGH PULSED CURRENT WAFER PROBING IN HIGH TEMPERATURE CONDITIONS: COMPREHENSIVE FRAMEWORK FOR VERTICAL AND CANTILEVER PROBE DESIGN

Presented by ‘Technoprobe’...

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28/06/2013

PROBING OF BUMP WAFER: TPEG™ MEMS T3 VERSUS COBRA LIKE TECHNOLOGY

Presented by ‘STMicroelectronics’ and ‘Technoprobe’...

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28/06/2012

TPEG™: A NEW VERTICAL MEMS SOLUTION FOR HIGH CURRENT, LOW PITCH APPLICATIONS

Presented by ’Technoprobe’...

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23/06/2012

Improved Cantilever Probing minimizing scrub Marks – (“No Scrub Technology”)

Presented by ‘Freescale’ semiconductor and ‘Technoprobe’...

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23/06/2012

Wafer Probing challenges for automotive market

Presented by ‘ON Semiconductor’ and ‘Technoprobe’...

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Publications

Technoprobe TPEG™ MEMS T4 OPM eliminates challenges faced with Cobra-like solutions

High-end, high-power devices: an integrated solution at probe card level

5G Means Higher Frequency, Higher RF Port Count, and Higher Parallelism

Awarded best overall presentation – SWTW 2018

Awarded best data presentation – SWTW 2018

TPEG™ MEMS RF+ Technology for Vertical Probe Heads

TPEG™ Mantis: a new solution for multiple advanced applications

HBM MICRO PILLAR GRID ARRAY PROBING CHALLENGES

PULSED CCC AND MAC: A NUMERICAL MODEL FOR VERTICAL PROBE DESIGN

AMD HIGH PIN COUNT PROBING CHALLENGES ON LEADING EDGE GPU: TECHNOPROBE TPEG MEMS VS. COBRA

A NEW APPROACH TO LOW PIN COUNT PRODUCTS TEST FOUND VERTICAL PROBES FOR TO BE SUPERIOR TO CANTILEVER

GENERAL OVERVIEW ON PAD DAMAGE: PROBE KEY PARAMETERS AND OTHER CAUSES

CHALLENGES PROBING NEXT GENERATION FULL ARRAY PRODUCTS WITH 60 UM PITCH AND BELOW

ADDRESSING 80 UM PITCH CU PILLAR BUMP WAFER PROBING: TECHNOPROBE TPEG™ MEMS SOLUTION

HIGH PULSED CURRENT WAFER PROBING IN HIGH TEMPERATURE CONDITIONS: COMPREHENSIVE FRAMEWORK FOR VERTICAL AND CANTILEVER PROBE DESIGN

PROBING OF BUMP WAFER: TPEG™ MEMS T3 VERSUS COBRA LIKE TECHNOLOGY

TPEG™: A NEW VERTICAL MEMS SOLUTION FOR HIGH CURRENT, LOW PITCH APPLICATIONS

Improved Cantilever Probing minimizing scrub Marks – (“No Scrub Technology”)

Wafer Probing challenges for automotive market