Our MEMS technologies for Vertical Probe Cards

The proprietary technology TPEG™ MEMS surpasses the limits of traditional MEMS technologies used to produce the contact probes of Probe Card.
What is unique about the TPEG™ process is the flexibility in the choice of materials and alloys for the production of probes and the possibility of ‘customization’ of their geometries to suit the applications required by our customers. It combines this incredible advantage a mechanical precision of less than 1 micron.
TPEG™ process allows us to produce millions of probes with short cycle times and maximum yields. Not satisfied with the already excellent results, we have developed additional technology that makes it even more extraordinary performance of our products, ARIANNA™.




TPEG™ MEMS

In 2007 we were the first in the world to introduce on the market MEMS Probe Cards assembled with Vertical configuration.
This has allowed us to take and keep, over the years, the advantage of offering the marketplace the contact probes more advanced in the world, becoming a real point of reference.
We have become leader in testing the non-memory wafer and our MEMS technology consents us to face the more complex customers requests: electric performances more and more extreme, always more reducing of pitch and increasing of density, high mechanic precision, test temperature up to 200°C, reduced time-cycle, high parallelism and eventually easy reparability and simple maintenance.
Here below our contact probes portfolio, depending on the pitch (minimum distance of pads or bumps on the testing wafer) and on the application:

ARIANNA™

The ARIANNA™ technology complements the TPEG™ MEMS technology. Thanks to ARIANNA™ technology we reached an additional degree of freedom in design and manufacturing of contact probes. TPEG™ MEMS technology allows to produce probes with composite alloys. In addition, ARIANNA™ technology allows us to create inserts in special materials in specific zones of the probe where special requirements are mechanical or electrical properties. The result is a new generation of contact probes with performance never achieved until now.

Our Probing solution

Select the pitch range of your interest to discover the Technoprobe solutions.

PITCH
400-150
Large Solder bump, WLCSP.
PITCH
150-130
Solder bump, Copper pad.
PITCH
130-90
Solder bump, Copper pad.
PITCH
80
Large Al-pad, PoAA, Small bump.
PITCH
60
Small Pad, PoAA, Cu-pillar bump.
PITCH
50
Small Pad, PoAA, uCu-pillar bump.
PITCH
≤ 40
Small Pad, PoAA, uCu-pillar bump.

TPEG™ MEMS Solution

TPEG™ MEMS T3 Probe Card technology offers the highest degree of customization and scalability in the market.
The increasingly demanding requirements of next generation microprocessors and mobile devices are successfully fulfilled by this technology, that allows probing capability on dense array layouts of bumps and copper pillar bumps (down to 80 µm) and outstanding stability of the contact resistance with tightly controlled bump marks

TPEG™ MEMS T3 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump and pillar Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

Cobra replacment for solder bump and WLCSP applications

TPEG™ MEMS C130 Main Features

» Minimum pitch down to 130 µm on full array configuration
» CCC up to 1500 mA per probe
» Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ Solution

TPEG™ MEMS Solution

TPEG™ MEMS T3 Probe Card technology offers the highest degree of customization and scalability in the market.
The increasingly demanding requirements of next generation microprocessors and mobile devices are successfully fulfilled by this technology, that allows probing capability on dense array layouts of bumps and copper pillar bumps (down to 80 µm) and outstanding stability of the contact resistance with tightly controlled bump marks

TPEG™ MEMS T3 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump and pillar Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

TPEG™ MEMS S90 Probe Card technology enhances TPEG™ MEMS T3 design offering increased frequency performance.

TPEG™ MEMS S90 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump and pillar bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

Cobra replacment for solder bump and WLCSP applications

TPEG™ MEMS C130 Main Features

» Minimum pitch down to 130 µm on full array configuration
» CCC up to 1500 mA per probe
» Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

Cobra replacment for solder bump and WLCSP applications

TPEG™ MEMS C110 Main Features

» Minimum pitch down to 110 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ Solution

ARIANNA™ A3 technology addresses testing on copper pad applications

ARIANNA™ A3 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Copper pad applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

TPEG™ MEMS Solution

TPEG™ MEMS T3 Probe Card technology offers the highest degree of customization and scalability in the market.
The increasingly demanding requirements of next generation microprocessors and mobile devices are successfully fulfilled by this technology, that allows probing capability on dense array layouts of bumps and copper pillar bumps (down to 80 µm) and outstanding stability of the contact resistance with tightly controlled bump marks

TPEG™ MEMS T3 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump and pillar Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

TPEG™ MEMS S90 Probe Card technology enhances TPEG™ MEMS T3 design offering increased frequency performance.

TPEG™ MEMS S90 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump and pillar bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

Cobra replacment for solder bump and WLCSP applications

TPEG™ MEMS C110 Main Features

» Minimum pitch down to 110 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ Solution

ARIANNA™ AS90 technology addresses testing on copper pad and copper pillar applications combined with higher frequency performance than ARIANNA™ A3.

ARIANNA™ AS90 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Copper pad applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ A3 technology addresses testing on copper pad applications

ARIANNA™ A3 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Copper pad applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

TPEG™ MEMS Solution

TPEG™ MEMS T4 Probe Card technology delivers probing capability to applications where extreme current carrying capability and temperature requirements are of the essence, like automotive power devices. This technology offers also the advantage of minimizing the number of probes needed per pad and therefore the flexibility of reducing the pads opening

TPEG™ MEMS T4 Main Features

» Minimum pitch down to 70 µm
» CCC up to 1500 mA per probe
» Al-Pad, PoAA and OPM applications
» Patented probe card architecture for excellent mechanical stability at high temperature
» Customizable Gram force

TPEG™ MEMS T1 Probe Cards technology is the definitive answer to requests for pad layout flexibility. Specifically designed for advanced logic and SoC devices probing.TPEG™ MEMS T1 Technology possesses a unique combination of very fine pitch capability, reduced contact force, and reduced scrub area.
TPEG™ MEMS T1 is also available in a low force option for use in copper-pillar bump application down to 80um pitch full array.

 

TPEG™ MEMS T1 Main Features

» Fine pitch down to 55 µm in line & 80 µm Full-Array
» CCC up to 800 mA per probe
» Ultra -Low force for probing over active area
» Reduced scrub area over the entire product lifetime
» Ultra stable contact resistance also at high temperature
» Al-pad, PoAA or Cu-pillar Bump applications
» Customizable Gram force

ARIANNA™ Solution

TPEG™ MEMS Solution

Enhanced designed to achieve 60µm Full-Array applications.

TPEG™ MEMS T60 Main Features

» Fine pitch down 60µm Full-Array
» Al-Pad, PoAA and Cu pillar-bump applications
» Very-Low force for probing over active area
» Reduced scrub area over the entire product lifetime
» Ultra stable contact resistance also at high temperature

TPEG™ MEMS T1 Probe Cards technology is the definitive answer to requests for pad layout flexibility. Specifically designed for advanced logic and SoC devices probing.TPEG™ MEMS T1 Technology possesses a unique combination of very fine pitch capability, reduced contact force, and reduced scrub area.
TPEG™ MEMS T1 is also available in a low force option for use in copper-pillar bump application down to 80um pitch full array.

 

TPEG™ MEMS T1 Main Features

» Fine pitch down to 55 µm in line & 80 µm Full-Array
» CCC up to 800 mA per probe
» Ultra -Low force for probing over active area
» Reduced scrub area over the entire product lifetime
» Ultra stable contact resistance also at high temperature
» Al-pad, PoAA or Cu-pillar Bump applications
» Customizable Gram force

ARIANNA™ Solution

TPEG™ MEMS Solution

Ultra Fine pitch solutions down to 50µm Full-Array applications.

TPEG™ MEMS T50 Main Features

» Fine pitch down 50µm Full-Array
» Al-Pad, PoAA and µCu pillar-bump applications
» Ultra-Low force for probing over µCu pillar-bump
» Reduced scrub area over the entire product lifetime

ARIANNA™ Solution

ARIANNA™ A50 Probe Cards technology provides very fine pitch capability and is specifically designed for advanced logic and SoC devices probing when probing on copper-pillar

TPEG™ MEMS A50 Main Features

» Fine pitch down to 50 µm Full-Array
» Ultra -Low force
» Probing over Copper-pillar without cap
» Ultra stable contact resistance

TPEG™ MEMS Solution

Ultra Fine pitch solutions down to 40µm Full-Array applications.

TPEG™ MEMS T40 Main Features

» Ultra Fine pitch down to 40µm Full-Array
» Al-Pad, PoAA and µCu pillar-bump applications
» Ultra-Low force for probing on µCu pillar-bump
» Reduced scrub area over the entire product lifetime

ARIANNA™ Solution

ARIANNA™ A40 Probe Cards technology provides very fine pitch capability and is specifically designed for advanced logic and SoC devices probing when probing on copper-pillar

TPEG™ MEMS A40 Main Features

» Fine pitch down to 40µm Full-Array
» Ultra -Low force
» Probing over ÁCopper-pillar without cap
» Ultra stable contact resistance