Mobile

Infinite possible connections where speed is the starting and arrival point
From Chips to Apps. Be connected everywhere you are. Freedom with a click.

Everyday

Organizer, telephone, contacts, entertainment, picture, communication, calculator, search on line, smartphone, represent the mobile era: I’ve got all I need in my pocket, wherever I am.

Mobile Approach

The world of mobile communication is the one which sets out the most complex challenges for chip-maker: the faster implementation of advanced technological bottlenecks (<28nm) to get the continuing chips size reduction, while adding more and more integrated functionalities and reducing the energy consumption, which is typical of mobile devices. Increasingly advanced packages, which use Cu-pillar-bump or Cu-pillar, with pitch getting smaller, need probe cards able to test more chips at a time, rising the pin-counts (more than 30.000) and achieving electric and mechanic performances of highest standards in order to grant the signal integrity and avoid damaging the Cu-pillar-bumps of contact. It is precisely in this so dynamic and turbulent sector we built our leadership, providing the most advanced Probe Card in the world, both in terms of min. pitch and current capacity per probe and of lifetime of the probe itself, by enabling our customers to cut the testing costs.



TPEG™ MEMS Solutions

Enhanced designed to achieve 60µm Full-Array applications.

TPEG™ MEMS T60 Main Features

» Fine pitch down 60µm Full-Array
» Al-Pad, PoAA and Cu pillar-bump applications
» Very-Low force for probing over active area
» Reduced scrub area over the entire product lifetime
» Ultra stable contact resistance also at high temperature

Ultra Fine pitch solutions down to 50µm Full-Array applications.

TPEG™ MEMS T50 Main Features

» Fine pitch down 50µm Full-Array
» Al-Pad, PoAA and µCu pillar-bump applications
» Ultra-Low force for probing over µCu pillar-bump
» Reduced scrub area over the entire product lifetime

Ultra Fine pitch solutions down to 40µm Full-Array applications.

TPEG™ MEMS T40 Main Features

» Ultra Fine pitch down to 40µm Full-Array
» Al-Pad, PoAA and µCu pillar-bump applications
» Ultra-Low force for probing on µCu pillar-bump
» Reduced scrub area over the entire product lifetime

TPEG™ MEMS T4 Probe Card technology delivers probing capability to applications where extreme current carrying capability and temperature requirements are of the essence, like automotive power devices. This technology offers also the advantage of minimizing the number of probes needed per pad and therefore the flexibility of reducing the pads opening

TPEG™ MEMS T4 Main Features

» Minimum pitch down to 70 µm
» CCC up to 1500 mA per probe
» Al-Pad, PoAA and OPM applications
» Patented probe card architecture for excellent mechanical stability at high temperature
» Customizable Gram force

TPEG™ MEMS T3 Probe Card technology offers the highest degree of customization and scalability in the market.
The increasingly demanding requirements of next generation microprocessors and mobile devices are successfully fulfilled by this technology, that allows probing capability on dense array layouts of bumps and copper pillar bumps (down to 80 µm) and outstanding stability of the contact resistance with tightly controlled bump marks

TPEG™ MEMS T3 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump and pillar Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

TPEG™ MEMS T1 Probe Cards technology is the definitive answer to requests for pad layout flexibility. Specifically designed for advanced logic and SoC devices probing.TPEG™ MEMS T1 Technology possesses a unique combination of very fine pitch capability, reduced contact force, and reduced scrub area.
TPEG™ MEMS T1 is also available in a low force option for use in copper-pillar bump application down to 80um pitch full array.

 

TPEG™ MEMS T1 Main Features

» Fine pitch down to 55 µm in line & 80 µm Full-Array
» CCC up to 800 mA per probe
» Ultra -Low force for probing over active area
» Reduced scrub area over the entire product lifetime
» Ultra stable contact resistance also at high temperature
» Al-pad, PoAA or Cu-pillar Bump applications
» Customizable Gram force

TPEG™ MEMS S90 Probe Card technology enhances TPEG™ MEMS T3 design offering increased frequency performance.

TPEG™ MEMS S90 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump and pillar bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

Cobra replacment for solder bump and WLCSP applications

TPEG™ MEMS C130 Main Features

» Minimum pitch down to 130 µm on full array configuration
» CCC up to 1500 mA per probe
» Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

Cobra replacment for solder bump and WLCSP applications

TPEG™ MEMS C110 Main Features

» Minimum pitch down to 110 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ Solutions

ARIANNA™ AS90 technology addresses testing on copper pad and copper pillar applications combined with higher frequency performance than ARIANNA™ A3.

ARIANNA™ AS90 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Copper pad applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ AS80  technology testing on copper pillar applications.

ARIANNA™ AS80 Main Features

» Minimum pitch down to 80 µm on full array configuration
» Copper pad applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ A50 Probe Cards technology provides very fine pitch capability and is specifically designed for advanced logic and SoC devices probing when probing on copper-pillar

TPEG™ MEMS A50 Main Features

» Fine pitch down to 50 µm Full-Array
» Ultra -Low force
» Probing over Copper-pillar without cap
» Ultra stable contact resistance

ARIANNA™ A40 Probe Cards technology provides very fine pitch capability and is specifically designed for advanced logic and SoC devices probing when probing on copper-pillar

TPEG™ MEMS A40 Main Features

» Fine pitch down to 40µm Full-Array
» Ultra -Low force
» Probing over ÁCopper-pillar without cap
» Ultra stable contact resistance

ARIANNA™ A3 technology addresses testing on copper pad applications

ARIANNA™ A3 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Copper pad applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force