Consumer

ANYONE ANYWHERE
Stunning graphics for videogames. For our smarter life. Always connected

Everyday

From sport to home security, from entertainment to study, in an always connected world.

Consumer Approach

Everything is online: we are connected to the web with several devices and we will be even more, just think what will mean the full realization of IoT…
And we look for entertainments, more and more compelling, and similar to the reality that we live or we would like to live. Thus we need electronics at high performance everywhere, with processors and computing capacity very powerful, with graphics cards capable to give vivid and 3D images and we demand for non-stop multimedia. This is what GPU producers commit for, processors for gaming or very high frequency memory, getting proficiency and balancing performance and cost, increasing the parallelism while testing and, as usual, getting chip smaller and powerful. We try to support them, by offering Probe Cards that guarantee high frequency and high pin count too, considering we have the largest products portfolio of the market, in order to meet the needs of our customers.



TPEG™ MEMS Solutions

Enhanced designed to achieve 60µm Full-Array applications.

TPEG™ MEMS T60 Main Features

» Fine pitch down 60µm Full-Array
» Al-Pad, PoAA and Cu pillar-bump applications
» Very-Low force for probing over active area
» Reduced scrub area over the entire product lifetime
» Ultra stable contact resistance also at high temperature

TPEG™ MEMS T4 Probe Card technology delivers probing capability to applications where extreme current carrying capability and temperature requirements are of the essence, like automotive power devices. This technology offers also the advantage of minimizing the number of probes needed per pad and therefore the flexibility of reducing the pads opening

TPEG™ MEMS T4 Main Features

» Minimum pitch down to 70 µm
» CCC up to 1500 mA per probe
» Al-Pad, PoAA and OPM applications
» Patented probe card architecture for excellent mechanical stability at high temperature
» Customizable Gram force

TPEG™ MEMS T3 Probe Card technology offers the highest degree of customization and scalability in the market.
The increasingly demanding requirements of next generation microprocessors and mobile devices are successfully fulfilled by this technology, that allows probing capability on dense array layouts of bumps and copper pillar bumps (down to 80 µm) and outstanding stability of the contact resistance with tightly controlled bump marks

TPEG™ MEMS T3 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump and pillar Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

TPEG™ MEMS T1 Probe Cards technology is the definitive answer to requests for pad layout flexibility. Specifically designed for advanced logic and SoC devices probing.TPEG™ MEMS T1 Technology possesses a unique combination of very fine pitch capability, reduced contact force, and reduced scrub area.
TPEG™ MEMS T1 is also available in a low force option for use in copper-pillar bump application down to 80um pitch full array.

 

TPEG™ MEMS T1 Main Features

» Fine pitch down to 55 µm in line & 80 µm Full-Array
» CCC up to 800 mA per probe
» Ultra -Low force for probing over active area
» Reduced scrub area over the entire product lifetime
» Ultra stable contact resistance also at high temperature
» Al-pad, PoAA or Cu-pillar Bump applications
» Customizable Gram force

TPEG™ MEMS S90 Probe Card technology enhances TPEG™ MEMS T3 design offering increased frequency performance.

TPEG™ MEMS S90 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump and pillar bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

Cobra replacment for solder bump and WLCSP applications

TPEG™ MEMS C130 Main Features

» Minimum pitch down to 130 µm on full array configuration
» CCC up to 1500 mA per probe
» Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

Cobra replacment for solder bump and WLCSP applications

TPEG™ MEMS C110 Main Features

» Minimum pitch down to 110 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ Solutions

ARIANNA™ AS90 technology addresses testing on copper pad and copper pillar applications combined with higher frequency performance than ARIANNA™ A3.

ARIANNA™ AS90 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Copper pad applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ AS80  technology testing on copper pillar applications.

ARIANNA™ AS80 Main Features

» Minimum pitch down to 80 µm on full array configuration
» Copper pad applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ A50 Probe Cards technology provides very fine pitch capability and is specifically designed for advanced logic and SoC devices probing when probing on copper-pillar

TPEG™ MEMS A50 Main Features

» Fine pitch down to 50 µm Full-Array
» Ultra -Low force
» Probing over Copper-pillar without cap
» Ultra stable contact resistance

ARIANNA™ A3 technology addresses testing on copper pad applications

ARIANNA™ A3 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Copper pad applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force