Computing

BEYOND RAW HARDWARE PERFORMANCE
High frequency for high processing performance. Miniaturization of more and more powerful processors. Power and signal integrity.

Everyday

From our home computers to cloud servers, from company laptops  to telecommunication networks, the intelligent modules of data processing “cleverly” lead us.

Computing Approach

The world of Personal Computer and of most advanced tablets, as well as Servers and Clouds requirement of the continuing need of access and data sharing, leads companies that design and produce chips to improve more and more their products in terms of processing speed and energy saving.
This means : processors much smaller and as much multifunction as possible, which requires Probe Card manufacturers grant signal integrity testing at high frequency, at high current capacity, not less, with the most challenging pitch of the whole semiconductor industry.
This means to realize products one generation ahead of what others do, walking on the roadmap leading to probe at 60-50-40 um. Pitch and further.
We are ready for it, since we have already developed and qualified solutions able to test devices with the lower pitch in the world…



TPEG™ MEMS Solutions

Enhanced designed to achieve 60µm Full-Array applications.

TPEG™ MEMS T60 Main Features

» Fine pitch down 60µm Full-Array
» Al-Pad, PoAA and Cu pillar-bump applications
» Very-Low force for probing over active area
» Reduced scrub area over the entire product lifetime
» Ultra stable contact resistance also at high temperature

TPEG™ MEMS T4 Probe Card technology delivers probing capability to applications where extreme current carrying capability and temperature requirements are of the essence, like automotive power devices. This technology offers also the advantage of minimizing the number of probes needed per pad and therefore the flexibility of reducing the pads opening

TPEG™ MEMS T4 Main Features

» Minimum pitch down to 70 µm
» CCC up to 1500 mA per probe
» Al-Pad, PoAA and OPM applications
» Patented probe card architecture for excellent mechanical stability at high temperature
» Customizable Gram force

TPEG™ MEMS T3 Probe Card technology offers the highest degree of customization and scalability in the market.
The increasingly demanding requirements of next generation microprocessors and mobile devices are successfully fulfilled by this technology, that allows probing capability on dense array layouts of bumps and copper pillar bumps (down to 80 µm) and outstanding stability of the contact resistance with tightly controlled bump marks

TPEG™ MEMS T3 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump and pillar Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

TPEG™ MEMS T1 Probe Cards technology is the definitive answer to requests for pad layout flexibility. Specifically designed for advanced logic and SoC devices probing.TPEG™ MEMS T1 Technology possesses a unique combination of very fine pitch capability, reduced contact force, and reduced scrub area.
TPEG™ MEMS T1 is also available in a low force option for use in copper-pillar bump application down to 80um pitch full array.

 

TPEG™ MEMS T1 Main Features

» Fine pitch down to 55 µm in line & 80 µm Full-Array
» CCC up to 800 mA per probe
» Ultra -Low force for probing over active area
» Reduced scrub area over the entire product lifetime
» Ultra stable contact resistance also at high temperature
» Al-pad, PoAA or Cu-pillar Bump applications
» Customizable Gram force

TPEG™ MEMS S90 Probe Card technology enhances TPEG™ MEMS T3 design offering increased frequency performance.

TPEG™ MEMS S90 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump and pillar bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

Cobra replacment for solder bump and WLCSP applications

TPEG™ MEMS C130 Main Features

» Minimum pitch down to 130 µm on full array configuration
» CCC up to 1500 mA per probe
» Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

Cobra replacment for solder bump and WLCSP applications

TPEG™ MEMS C110 Main Features

» Minimum pitch down to 110 µm on full array configuration
» CCC up to 1200 mA per probe
» Bump applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ Solutions

ARIANNA™ AS90 technology addresses testing on copper pad and copper pillar applications combined with higher frequency performance than ARIANNA™ A3.

ARIANNA™ AS90 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Copper pad applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ AS80  technology testing on copper pillar applications.

ARIANNA™ AS80 Main Features

» Minimum pitch down to 80 µm on full array configuration
» Copper pad applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force

ARIANNA™ A3 technology addresses testing on copper pad applications

ARIANNA™ A3 Main Features

» Minimum pitch down to 90 µm on full array configuration
» CCC up to 1200 mA per probe
» Copper pad applications
» Ultra stable contact resistance
» Reduced need of offline maintenance and increased test cell uptime
» Customizable Gram force