Flash Application
Technoprobe epoxy and
vertical technologies are the solution for reducing total cost of test
and increase test productivity for nonvolitive memories, including NAND
and NOR flash.
Epoxy technology can offer high parallelism up to 32 dice on 2 sides, minimum
pitch down to 80 µm and a working temperature from -40 to 130 °C.
ROUTE99™ Vertical technology enables high parallelism and high pin count
Flash device test up to 1 touch of 200 mm wafers. ROUTE60™ Vertical technology is the answer for reduced pitch and reduced bond pad
sizes with a lower probe force to reduce risk of pad damage.
The thermal stability and low CTE of the ceramic used in our probe head guarantees
a perfect alignment in KGD (known good die) testing from -40 to 150 °C.
Our design team will support you with short lead time for design on the most
popular platforms like Advantest T5377 and T5371, Credence XW and K2,
AGILENT V4400.
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