Dram Application
Technoprobe epoxy and
vertical technologies are the right answer to test DRAM device. Our
probe cards provide high signal integrity for high frequency Wafer test
for DRAM KGD (known good die) applications.
ROUTE99™ technology enables high parallelism and high pin count
device testing up to 1 touch of 200 mm wafers. ROUTE60™ Vertical technology is the answer for reduced pitch and reduced bond pad
sizes with a lower probe force to reduce risk of pad damage.
The thermal stability and low CTE of the ceramic used in our probe head guarantees
a perfect alignment in KGD (known good die) testing from -40 to 150°C.
Our design team will support you with short lead time for design on the most
popular platforms like Advantest T5377 and T5371, Credence XW and K2,
AGILENT V4400.
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